Device R&D team

· Developing ternary-based device manufacturing technology

· Development of TCAD-based manufacturing IP

· Development of wafer-level process technologies and technologies to improve mass production stability

· Development of technology application plan for scale down

Circuit design team

· T-SRAM Cell-to-Macro design

· Circuit IP development based on IC design

· Full range memory design based on manufacturing IP

· Ternary-based PPA enhancement circuit Custom design

System development team

· Chip-level characterization and compatibility evaluation

· Develop technology to support binary-based IP compatibility

· Validate BIST, ECC and repair capabilities

· QA testing and sign-off of designs

· Compiler customer support